Horizontal Infrastructure Handling For Integrated Circuit Devices

ABSTRACT

Systems and methods are provided that may be implemented to produce customized integrated circuit (IC) device parts together from a common base IC device part that is customized with settings or code to build different unique IC device parts for different purposes that are processed and output together from the manufacturing process. Different individual devices of the common base part may be customized (e.g., programmed) with different settings and/or code to build respective uniquely configured parts for different purposes, e.g., such as according to different respective part orders.

FIELD OF THE INVENTION

This disclosure generally relates to integrated circuit devices and,more particularly, to programming and testing of integrated circuitdevices.

BACKGROUND

Part test and programming of horizontal integrated circuit (IC) deviceproducts (i.e., customized small lots of integrated circuit partsprogrammed for different purposes) is very labor intensive anderror-prone due to customization per order, low part count per order,and high order count. These customized IC device parts are low quantityhigh order count products that with conventional manufacturing andprogramming processes require a large amount of effort by individualhuman operators for each order. The output IC device parts areindividually handled in tape and reel media cut tape also requiringlarge amount of documentation and effort to handle and ship. The overallmanufacturing and programming process for such customized IC devicesrequires a long list of tasks and process steps. These tasks and processsteps include individual part handling per order (physically countingparts), transacting orders in business software packages such asSoftware Applications Products (SAP), recording order details on lottravelers, setting up a tester and handler and testing/programming theparts, setting up a laser marker and marking parts (if the part is postmarked), setting up and scanning parts for defects, and managing theorder to shipping.

FIG. 1 illustrates a conventional architecture 100 for part test andprogramming of custom horizontal integrated circuit (IC) device productsfrom a common type of incoming uncustomized base IC device parts 103. Asdescribed below, the test and programming methodology of architecture100 is performed in its entirety to produce one type of custom IC devicepart at a time before being repeated again in its entirety to produceanother type of custom IC device part. Thus, the methodology ofarchitecture 100 is repeated over and over for different individual ICdevice part orders. As illustrated, an individual custom IC device partorder 111 specifies custom part programming and is provided tobookkeeping and order software (BKO) 102. A human planner 108 interactswith BKO 102 by reading the details of the given single custom IC devicepart order 111 from BKO 102 and then providing scheduling information toBKO 102 that specifies testing and programming parts for the givenindividual order 111 as a single lot by itself. A human operator 110interacts with BKO 102 by reading scheduling information and specifiedcustom programming directly from BKO 102 for the given individual order111, and then controls programming and testing equipment 104 to customprogram IC base parts 103 according to the individual order 111, and totest the programmed parts. Operator 110 reads the programmed part testresults from programming and testing equipment 104 and provides the testresults to BKO 102. Thus all commonly programmed custom parts of thesingle given custom order 111 are processed (tested and programmed) byprogramming and testing 104 under control of human operator 110 in batchfashion as a single lot 120 of commonly programmed custom partscorresponding to custom part order 111 which is then singulated by cuttape and reel media (i.e., as a single cut tape and reel media thatcontains only the same type of commonly programmed parts specified bythe single given custom part order 111) for finished goods inventory(FGI) processing 106. This process is repeated for each different lot120 singulating each order in cut tape and reel media, requiring thetape cut and packaged into an electrostatic bag after every individuallot 120 is manufactured and taped.

In FGI processing 106, the custom IC device parts of a single lot 120 inthe electrostatic bag is handled for the single custom part order 111into an individual package 122 for shipping under the control of humanoperator 112 as a single lot of commonly programmed custom parts to anend destination 130 specified by or otherwise corresponding to the givencustom IC device part order 111. As shown, human operator 110 interactswith FGI processing 106 by handling cut tape and reel media in anelectrostatic bag individual custom IC device parts from single lot 120for shipping. Thus, the customized IC devices corresponding to thesingle custom part order 111 are separately processed from any othercustom part order and are shipped together as one lot, with eachprocessed and shipped lot of IC devices corresponding to only one custompart order. In this regard, methodology of architecture 100 is repeatedover and over for each different custom part order to produce aseparately processed lot 120 of custom programmed devices for eachdifferent custom part order.

SUMMARY

Disclosed herein are systems and methods that may be implemented toproduce customized integrated circuit (IC) device parts together from acommon type of uncustomized base IC device part that is customized withsettings or code to build different unique IC device parts for differentpurposes that are processed and output together from the manufacturingprocess. In one exemplary embodiment, the disclosed systems and methodsmay be implemented to quickly and reliably produce customized individualparts from a common type of base part using minimized labor as comparedto labor required for producing such parts using conventional custom ICmanufacturing and programming processes. Different individual devices ofthe common uncustomized base part may be customized (e.g., programmed)with different settings and/or code to build respective uniquelyconfigured parts for different purposes, e.g., such as for differentcustomers according to different respective part orders. In oneembodiment, the disclosed systems and methods may be implemented tomanufacturer different uniquely customized parts from a common base partin a manner that reduces manufacturing costs, reduces chance formanufacturing errors, and improves customized part order processingcycle time.

In one exemplary embodiment, the disclosed systems and methods may beimplemented by a device manufacturer to collect customization data froman individual part customer (e.g., directly from the customer ifdesired) and to build customized part lots with minimal human operatorinteraction. In a further embodiment, customization data may be enteredas a transaction in a manufacturing execution system of a devicemanufacturer. Such customization data may include custom programminginformation and/or other part customization details such as custommarking information for individual devices of each lot of customizedparts (i.e., if required or otherwise desired). Customized parts mayalso be built using specified quality checks for each different type ofcustomized parts corresponding to a given part order, and themanufactured customized parts of many different part orders may beprocessed together and output as multiple lots onto a single tape andreel media output reel (e.g., with each lot of different part typesbeing identified by a tape and reel cover tape label with part and lotinformation). When employed, the output cover tape label may be used toenable reliable identification and shipment of each of the individuallots that have processed and included together on the same output tapemedia.

The disclosed systems and methods may be implemented in one embodimentas a method to bulk process relatively small custom IC part orders withindividual lot identification. In another embodiment, a multi-platformconfiguration system (e.g., server or computer workstation) may beimplemented with a scheduler that aggregates small quantity custom ICpart product orders and determines what mother lots of base IC parts maybe utilized to process and fulfill them, and with a horizontalinfrastructure part customization that is configured to manage customerpart customization data from customer to tester.

In another embodiment, a tester cell master may be implemented toprovide manufacturing execution system integration to automate order/lotprocessing transactions and what custom IC part orders may be processedwith a given mother lot. A tester cell master may also be implemented inone embodiment to provide tester integration in which cell masterautomates setting up tester test program and customization data for eachcustom IC part lot. A tester cell master may also be implemented toachieve handler integration in which the tester cell master orchestratesa part handler and all attached devices (e.g., tester, laser mark,labeler, scan) for processing each custom IC part order without humaninteraction between orders. A tester cell master may also be implementedin one embodiment to achieve marker integration, e.g., if a given customIC part requires or otherwise specifies a custom mark, the tester cellmaster may be configured to automate what custom mark/s is put on acustom IC part/s for each custom order. A tester cell master may also beimplemented in one embodiment to control a labeler (e.g., a tape andreel cover tape labeler) such that many custom IC part lots may bemanufactured and output onto one outgoing tape and reel with no humaninteraction such that each of the individual custom IC part lots beingindividually identified by a label for each custom IC part lot. In thisregard, tape and reel media labels may be employed that include customIC part identifier information that allow for post processing of theindividual custom IC part orders for shipment, e.g., each label mayinclude a barcode that may be scanned to lookup end destinationinformation details, (e.g., such as customer delivery address), and thecustom IC parts of an individual custom IC part order cut from theoutgoing tape reel for shipment according to the destination details.

In one respect, disclosed herein is a system configured to producecustomized integrated circuit (IC) device parts from multiple incominguncustomized base IC parts. The system may include: a test systemincluding one or more test sockets, a handler, and an outgoing tapereel; and at least one processing device configured to communicate withthe test system and programmed to control the handler to place each ofmultiple incoming uncustomized base IC device parts into the testsockets for custom programming to produce multiple custom programmed ICdevice parts, and then to remove and transfer the multiple customprogrammed IC device parts into individual part compartments of a commoncarrier tape of the outgoing tape reel and cover the custom programmedIC device parts within the individual part compartments with a covertape over the individual part compartments. Then at least one processingdevice may be further configured to communicate with the test system andbe programmed to: control test socket custom programming of a commontype of uncustomized base IC parts in different ways so as to producerespective different types of custom IC device parts specified bydifferent custom IC part orders, and then control positioning thedifferent types of custom IC device parts specified by the differentcustom IC part orders into separate part compartments defined in thecommon carrier tape of a single outgoing reel of tape media.

In another respect, disclosed herein is a method of producing customizedintegrated circuit (IC) device parts from uncustomized base IC parts,including: using at least one processing device to custom program acommon type of uncustomized base IC parts in different ways so as toproduce respective different types of custom IC device parts specifiedby different custom IC part orders; and then positioning the differenttypes of custom IC device parts specified by the different custom ICpart orders into separate part compartments defined in a common carriertape of a single reel of tape media.

In another respect, disclosed herein is a reel of tape media including:an elongated tape wound on a tape reel, the elongated tape includingmultiple separate part compartments defined therein that are configuredto contain integrated circuit (IC) device parts; and different types ofcustom IC device parts positioned in the separate part compartmentsdefined in the same elongated tape wound on the tape reel, the differenttypes of custom IC device parts being differently programmed from acommon type of uncustomized base IC part according to the specificationsof respective different custom IC part orders.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a simplified block diagram of conventionalarchitecture for part test and programming of custom horizontalintegrated circuit (IC) device products.

FIG. 2 illustrates a simplified block diagram of an architecture thatmay be employed to setup and run multiple aggregated custom IC devicepart orders at one time according to one exemplary embodiment of thedisclosed systems and methods.

FIG. 3 illustrates a simplified block diagram of various hardware andlogic components according to one exemplary embodiment of the disclosedsystems and methods.

FIG. 4 illustrates test system components communicatively coupled totester and horizontal testing logic according to one exemplaryembodiment of the disclosed systems and methods.

FIG. 5 illustrates a reel of outgoing tape media containing custom ICdevice parts according to one exemplary embodiment of the disclosedsystems and methods.

FIG. 6 a reel of tape media containing custom IC device parts accordingto one exemplary embodiment of the disclosed systems and methods.

FIG. 7 illustrates custom part identifier information according to oneexemplary embodiment of the disclosed systems and methods.

DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

FIG. 2 illustrates an exemplary embodiment of an architecture 200 thatmay be employed to setup and run multiple aggregated custom IC devicepart orders at one time. In this embodiment, architecture 200 may beemployed for part testing and programming of multiple different types ofcustom horizontal integrated circuit (IC) device products from a commontype of multiple incoming uncustomized base IC device parts 203 that maybe previously fabricated, assembled and packaged tested (e.g., base parttesting) as shown in FIG. 3. As shown, multiple different individualcustom IC device part orders 211 ₁ to 211 _(N) are provided to logic ofcombination bookkeeping, order and manufacturing execution system(BKO/MES) 202. Custom IC device part orders 211 may be received, forexample, from one or more customers of an IC device productmanufacturer. Each of multiple custom part orders 211 may specify a lotof the same type of multiple custom IC device parts corresponding to aparticular custom part type (e.g., by part number, part name, etc.)having custom programming that is different from the custom programmingof other different custom IC device part types specified by each of theother multiple custom part orders 211 ₁ to 211 _(N). As shown, a humanplanner 208 may interact with BKO/MES 202 (e.g., via graphical userinterface I/O) by reading the details of the multiple custom IC devicepart orders 211 ₁ to 211 _(N) from BKO/MES 202 and then providesscheduling information to BKO/MES 202 (e.g., dates, etc.) that specifiesscheduling for testing and programming of parts for each of therespective individual orders 211 ₁ to 211 _(N). A human product testengineer (PTE) 209 may also read statistical bin limit (SBL) and resultsof other IC test results from wafer-level, probe, and package testingthat is performed on custom IC device parts that are programmed andtested by custom part test and program components 390.

In one embodiment, BKO/MES 202 may implemented as logic (e.g., softwareand/or firmware) executing on one or more processing devices 293 (e.g.,such as CPU/s) of a computer server or computer workstation that itselfis wired and/or wirelessly coupled to one or more networks (e.g., suchas Internet and/or corporate intranet) to receive custom orderinformation from customers or other users, and that is also wired orwirelessly coupled to input/output (I/O) device/s such as graphical userinterface “GUI” displays, keyboards, mice, etc. so as to allow BKO/MES202 to exchange data and control information with human planner 208 andhuman PTE 209. A computer server or computer workstation running BKO/MES202 may also be coupled via suitable data bus and/or wireless datacommunication to exchange data and control information with othercomponents of architecture 200 that execute on one or more processingdevices 293 of the same or different computer server or workstation asBKO/MES 202 such that horizontal testing logic 254 and MPC 250 maycommunicate with BKO/MES 202 to automate lot processing transactions.Examples of such other components of architecture 200 include, but arenot limited to, multi-platform configuration (MPC) server 250 andBKO/MES transactor 260 of horizontal testing logic 254. Particularexamples of BKO/MES 202 include, but are not limited to SystemApplication Products (SAP) R/3 System available from SAP SE of Walldorf,Germany; or any other suitable enterprise resource planning (ERP)systems such as available from Oracle, PeopleSoft, etc.

In the embodiment of FIG. 2, MPC server 250 may be a computerworkstation or other type of server system having at least oneprocessing device 293 (e.g., CPU) configured to query and access detailsof scheduled custom IC device part orders 211 from BKO/MES 202. MPCserver 250 may also be configured to receive and transfer partcustomization details (e.g., such as specified firmware programming forthe customized parts, specified firmware settings for the customizedparts, custom part flags or values, customer provided firmware, custommarking information laser such as marking lines, testing for customprogramming, etc.) that are received by MPC server 250 directly from acustom order information source (e.g., via a computer server) throughfile transfer protocol (FTP) server to horizontal testing logic 254 aswill be described further herein with regard to FIG. 3. In one exemplaryembodiment, individual part customization details may be managed by MPCserver 250 using customer IC device part number, with BKO/MES not awareof these part customization details.

MPC server 250 may also be configured to analyze the part customizationdetails of different (e.g. relatively small quantity such that multiplecustom product orders can be contained on a single outgoing reel 225)custom product orders 211 and to aggregate the multiple orders 211 ₁ to211 _(N) into groups of different orders 211 that may be programmed froma common compatible type of raw stock uncustomized base IC parts 203(e.g., the same mother lot or base part number). In this regard, a firstgiven mother lot may be compatible for use (e.g., programming) toproduce the custom IC device parts of a group (e.g., subset) of one ormore custom orders 211 (e.g., such as custom orders 211 ₁, 211 ₂, and211 ₅) but not compatible for use to produce the custom IC device partsof a different group (e.g., subset) of one or more different customorders 211 (e.g., such as custom orders 211 ₃, and 211 ₄). Compatibilityfor fulfilling specifications of a given custom IC device part order maybe based on, for example, physical and/or processing capabilities of theuncustomized base IC parts 203 of a given mother lot, e.g., such as partprocessing speed, part programming language, part memory size, partpower consumption, physical size of individual part, part connector/pinnumber and/or identity, part connector/pin geometry and/or orientation,etc.

MPC server 250 may be provided with a processing device 293 (e.g., CPU)configured to access stored data (e.g., such as look up tables) thatindicate what type of uncustomized base IC parts 203 is compatible tofulfill a given custom IC device part order 211 based on thecustomization details associated with the custom IC device partspecified by the given order 211. In this regard, a compatible type ofuncustomized base part 203 may be pre-assigned for producing a giventype of custom IC device part based on customer or custom partmanufacturer preference, and/or may be selected (e.g., by customer,custom part manufacturer or automatically by MPC 250) for producing agiven type of custom IC device part based on suitability of thecompatible type of uncustomized base part 203 for producing the giventype of custom IC device part. Types of uncustomized base IC parts 203that are unsuitable for producing a given type of custom IC device partinclude types of uncustomized base IC parts 203 that are incapable ofbeing programmed according to the programming specifications for thegiven type of custom IC device part, or that otherwise cannot be used tomeet one or more other physical and/or processing capabilityspecifications of the given type of custom IC device part. Once multipleorders 211 ₁ to 211 _(N) have been aggregated into one or more groups tobe programmed from one or more respective common types of uncustomizedbase IC parts 203, MPC server 250 may schedule each aggregated group ofcustom IC device part orders 211 to be fulfilled from a given type ofraw stock uncustomized base IC parts 203 (i.e., in order to meet theoriginal custom part scheduling information provided to BKS/MES 202 byplanner 208), and to provide this scheduling information through FTPserver 252 to processing device/s 293 executing horizontal testing logic254.

Still referring to the embodiment of FIG. 2, one or more processingdevices 293 (e.g., such as CPU, controller, microcontroller, processor,microprocessor, ASIC, FPGA, etc.) may be configured to execute IC testerand programming logic (e.g., software and/or firmware) for test system259 that may be implemented to facilitate horizontal testing and customprogramming in a manner as described further herein. In one exemplaryembodiment, logic 254 may be executed on a computer server or computerworkstation that is wired or wirelessly coupled (e.g., via Internetand/or corporate intranet) to exchange data and/or control informationwith processing devices 293 executing BKO/MES logic 202, as well as withcustom IC device part test and program components 390. As shown,horizontal testing logic 254 includes horizontal test user interface 262that may be wired and/or wirelessly coupled to input/output (I/O)device/s such as graphical user interface “GUI” displays, keyboards,mice, etc. to allow a human operator 210 to access data and to providecommand information to horizontal testing logic 254. Other components ofhorizontal testing logic 254 include, but are not limited to, a BKO/MEStransactor 260 that may be present to interface with BKO/MES 202 andthat may be configured to automatically transact (e.g., or process theorders for fulfillment) the lots based on pre-specified orderinformation and/or otherwise so that test system 259 may runautomatically without stopping e.g., by locking the mother lot so noother tester can attempt to process it, by locking individual orders,creating sublots for each individual order, processing results of testand part customization, and unlocking mother lot remnant quantity andany unprocessed orders after processing is complete.

As further shown in FIG. 2, each of horizontal tester user interface 262and BKO/MES transactor 260 are coupled to bi-directionally exchange dataand any other applicable information with a horizontal tester cellmaster 264 that may itself be configured to monitor and control andorchestrate all programming, testing, handling and other operationsperformed by custom IC device part test and program components 390,e.g., including test system 259 components. In the illustratedembodiment, custom IC device part test and program components 390include test system 259 and tester 261 which are described furtherherein. As shown, custom IC device part test and program components 390are configured to receive incoming uncustomized base IC device parts 203that are to be tested, customized (e.g., programmed), marked and handledby various custom IC device part test and program components 390. Inthis regard, incoming uncustomized base IC device parts 203 may be agroup or “mother lot” of multiple identical IC device parts (e.g., cutor otherwise diced from the same device wafer) that are to be customizedin different ways by custom IC device part test and program components390.

In the embodiment of FIG. 2, test system 259 may include components suchas a part handler, input media handler, daughter card with specificpackage sockets, vision scan, laser marker, output media packager, etc.that are configured to receive, test and program each individualuncustomized IC base part 203. Examples of such custom programminginclude, but are not limited to, custom frequencies, custom part flagsor values, customer supplied firmware, laser mark lines, etc. Custom ICdevice part test and program components 390 may perform variousdifferent marking, labeling, and/or handling tasks to produce a singlereel of tape media 225 that includes a covered carrier tape rolled on atake-up reel and that contains multiple different lots 220 ₁ to 220 _(N)of differently programmed custom IC device parts that correspond todifferent custom part orders 211 ₁ to 211 _(N), respectively. In thisregard, a single reel of media 225 may be provided from test system 259that contains differently programmed custom IC device parts as specifiedby the different custom part orders 211. For example, in one embodiment,a first custom IC device part lot 220 ₁ of one type of multiple customprogrammed parts may be placed near each other within part compartmentsof a given tape and reel media, while a second custom IC device part lot220 ₂ of another type of multiple custom programmed parts may be placednear each other within part compartments of the same given tape and reelmedia, etc.

Still referring to FIG. 2, each different type of custom programmed ICdevice parts contained in carrier tape part compartments of the samesingle reel 225 of media may be uniquely identified (e.g., either byindividual part or as a lot 220 of individual parts) so that the partsof each different type may be differentiated from the parts of otherdifferent types of custom programmed parts (e.g., which are also byindividual part or as a lot 220 of individual parts). Examples ofsuitable identification techniques that may be performed by test system259 include, but are not limited to, applying a label that displayscustom IC part identifier information (e.g., such as bar code) to thecover tape that is adjacent a group of part compartments of the carriertape of the tape reel 225 that contain parts of the same correspondingpart type, printing such custom part identifier information directlyonto the cover tape that is adjacent a group of carrier tape partcompartments of the tape reel 225 that contain parts of the samecorresponding part type, etc. In another embodiment, it is possible thatcustom part identifier information may be applied to a surface of thecarrier tape itself in a position adjacent a group of part compartmentsof the carrier tape of the tape reel 225 that contain parts of the samecorresponding part type.

As further shown in FIG. 2, the resulting single reel of tape media 225that contains multiple different types of custom IC device parts (e.g.,grouped together in lots 220 ₁ to 220 _(N)) may be provided (e.g., takento shipping, managed with paper travelers and barcode readers, etc.) forfinished goods inventory (FGI) processing 206 (e.g., a shippingoperation where custom IC device parts are individualized and shipped asorders using singulation, shipping label, box, etc.), which in oneembodiment may be controlled and monitored by human operator 210 asshown. In this regard, a tape media reel 225 may be transported in anysuitable manner (e.g., manually by human operator 210 or by automatedtransport device such as conveyor belt, industrial robot, etc.).

Included among the types of tasks that may be performed during FGIprocessing 206 is identifying and differentiating between the differenttypes of custom IC device parts contained in the part compartments ofsingle reel of tape media 225 by reading the bar code or other type ofidentifier label information displayed on a section of the tape mediacover of tape reel 225 that is located adjacent or on the partcompartments that contain each different given type of custom IC devicepart. As different respective types of custom IC device partscorresponding to different custom IC device part orders 211 areidentified in FGI 206, they may be segregated from other types of customIC device parts taken from the same tape media reel 225 for shipping orother type of transportation to an appropriate end destination 230 thathas been specified (e.g., in BKO/MES 202) by the corresponding custom ICdevice part order 211 for the given type of custom IC device parts. Forexample, in the illustrated embodiment of FIG. 2, custom IC device partsspecified by different custom part orders 211 ₁ to 211 _(N) may beprogrammed from uncustomized base IC parts 203 and placed in respectivelots 220 ₁ to 220 _(N) on tape media reel 225. The individual customparts of each of IC device part lots 220 ₁ to 220 _(N) may then beidentified and segregated for shipping to respective different enddestinations 230 ₁ to 230 _(N) that correspond to the respective custompart orders 211 ₁ to 211 _(N).

FIG. 3 illustrates one exemplary embodiment of block diagram thatfunctionally groups interrelated tasks of various hardware and logiccomponents 300 (including those previously described above in relationto architecture 200 of FIG. 2). As shown in FIG. 3, each of custom partorders 211 are received by BKO/MES 202 from a custom order informationsource (e.g., via sales force from a customer) and specify orderinformation that may include requested number of a particular custom ICdevice part type (e.g., including identity of a custom part typeassociated with the current order, number of individual custom partsordered by the current order, shipping address for the completed customparts, etc.). As shown, part customization information 302 correspondingto a new custom IC device part type (e.g., such as specified firmwareprogramming for the particular specified type of custom IC device part,specified firmware settings for the particular specified type of customIC device part, custom customer firmware, custom part flags or values,custom part marking such as laser marking, custom programming testing,etc.) may in one embodiment be separately provided (e.g., together withan assigned part number for the corresponding new custom IC device part)from a custom order information source automatically through a computerserver to MPC 250 for the given type of ordered custom IC device partspecified by order information 302. For example, part customizationinformation 302 may be provided to MPC server 250 across a network suchas Internet or intranet, etc. However, in an alternate embodiment, partcustomization information 302 may be maintained in pre-existing form onstorage of MPC server 250.

In any case, MPC server 250 may request that BKO/MES 202 create thenewly specified custom IC device part together with its identifiedappropriate uncustomized base IC device part in a part database ofBKO/MES 202. MPC server 250 may also send the new part customizationinformation 302 to horizontal tester cell master 264. In parallel, acustomer may separately order a specific number of the new custom ICdevice parts by the particular assigned part number for thecorresponding new custom IC device part and this order information maybe provided (e.g., from a computer server) to BKO/MES 202 as shown. MPC250 is configured to in turn retrieve existing part customizationinformation 302 for a given custom IC device part specified by eachcustom IC device part order 211, and to associate this retrieved partcustomization information 302 with the given custom IC device partnumber. Then BKO/MES 202 may schedule the custom part order 211 withthat custom IC device part number by providing the order information(e.g., number of custom parts, shipping address, customer identity) of agiven type of custom part specified by each custom part order 211 to MPCserver 250, which may also associate the corresponding partcustomization information 302 (e.g., specified firmware programming forthe particular specified type of custom IC device part, specifiedfirmware settings for the particular specified type of custom IC devicepart, custom frequencies, custom part flags or values, Customer suppliedfirmware, laser mark lines, etc.) using the custom IC device partnumber.

MPC server 250 may in turn aggregate the multiple orders 211 ₁ to 211_(N) into a group of different orders 211 that it determines from itsdatabase may be programmed from a common type of raw stock uncustomizedbase IC parts 203 (e.g., a common mother lot of the same type ofuncustomized base IC device parts). MPC server 250 may then provide thisscheduled information (e.g., aggregated order information andcorresponding uncustomized base part information) to horizontal testercell master 264 of custom part test and program components 390.Horizontal tester cell master 264 is configured to in turn control othercustom IC device part test and program components 390 (e.g., componentsof tester 261 and test system 259) to operate together to custom test,program, vision scan, and mark incoming uncustomized base IC parts 203to produce different specified custom IC device part types for theaggregated orders 211 from the specified mother lot of incominguncustomized base IC parts 203 that is specified by MPC server 250. Inthis way, MPC server 250 may be configured to control customization ofuncustomized base IC parts 203 by providing information (e.g.,aggregated order information and corresponding uncustomized base partinformation) to custom part test and program components 390 so that testsystem 259 correctly customizes uncustomized base IC parts 203 to buildor otherwise produce custom IC device parts 403 (e.g., see FIG. 5) thatfulfill the specifications of each order 211. In one embodiment, custompart test and program components 390 may be integrated together as acommon piece of equipment such that these processing tasks (e.g., customtest, programming and marking) may be completed on the same piece ofequipment without requiring marking (i.e., when post marking isoptionally employed)

In the illustrated embodiment, horizontal tester cell master 264 may beconfigured to orchestrate part customization and custom IC device partorder manufacturing by monitoring and controlling IC device partprogramming, testing, handling and other operations of test system 259and tester 261 of custom IC device part test and program components 390.Test system 259 and tester 261 may be controlled and/or executed bydifferent processing device/s 293, or may be integrated on a commonmachine that is controlled and/or executed by a common processingdevice/s 293. As shown, examples of possible components of test system259 may include tape and reel tape labeler 362, handler 364, lasermarker 366, scanner 368, etc. It is possible that each of theseindividual hardware components 362, 364, 366 and/or 368 may further beconfigured with its own processing device/s 293 for controlling itsoperation. For example, each of labeler 362 and handler 364 may includeits own computer workstation and CPU which controls its operation andprovides user interface for human operator/s. Such processing devicesand/or computer workstations may be communicatively coupled to aprocessing device 293 (e.g., that is executing horizontal testing logic254) of horizontal tester cell master 264 to allow data and controlinformation to be wired or wirelessly exchanged between horizontaltester cell master 264 and the individual custom IC device part test andprogram components 390. It will also be understood that it is possiblethat two or more of individual hardware components 263, 362, 364, 366and/or 368 may be controlled by a common (same) processing device,computer workstation, etc.

Still referring to FIG. 3, multiple incoming bulk base IC device parts203 may be fabricated (e.g., on a common wafer), singulated and thenassembled and package tested before being made available as raw stock tocustom part test and program components 390 for custom programming andtesting under the control and orchestration of horizontal tester cellmaster 264. In this regard, a human operator 210 of FIG. 2 may access acustom IC device part build plan information (e.g., via horizontaltester UI 262) that specifies a given type of uncustomized base ICdevice parts 203 as a common mother lot for a given group of aggregatedorders 211 as scheduled by MPC server 250, and that is displayed undercontrol of horizontal tester cell master 264. Based on the custom ICdevice part build plan information, the human operator may select andload a tape media reel that contains the type of mother lot uncustomizedbase IC parts 203 specified by the custom IC device part build planinformation for access by custom IC device part test and programcomponents 390. In an alternate embodiment, this selection and loadingof a mother lot may be automatically performed, e.g., by industrialrobot.

These incoming uncustomized base IC device parts 203 may be provided inseparate part compartments of an incoming reel of tape and real media.In this regard, only as many of a given type of incoming uncustomizedbase IC parts 203 may be provided at a given time that are required tosatisfy the number of uncustomized base IC parts 203 needed to fulfill agiven custom IC device part order 211, or that are required to satisfythe number of uncustomized base IC parts 203 needed to fulfill a givennumber of groups of aggregated multiple custom IC device part orders 211₁ to 211 _(N) that may be programmed from a common type of raw stockuncustomized base IC parts 203. In one embodiment, the number ofincoming uncustomized base IC device parts 203 needed to satisfy eachgiven custom IC device part order 211 may be split or singulated fromthe tape media of an incoming tape reel for customization prior tooutput together as separate identified custom IC device part sublots 220₁ to 220 _(N) in compartments of a continuous carrier tape of a singlecommon outgoing tape reel 225, e.g., without stopping or interruptingoperation of custom part test and program components 390. In oneembodiment, different lots of the same type of raw stock uncustomizedbase IC device part 203 may be taken from different respective incomingtape reels and tested/programmed by custom part test and programcomponents 390 to manufacture multiple different custom IC device partlots 220 ₁ to 220 _(N) that are output together as separate identifiedlots in a single common outgoing tape media reel 225. With fast hardwareIC socket change over, the same custom part test and program components390 (e.g., including components of test system 259) may be used toprogram different uncustomized base IC device parts 203 having differentpackage types.

In one embodiment, horizontal tester cell master 264 may control customIC device part test and program components 390 to run multipleaggregated custom IC device part orders 211 ₁ to 211 _(N) according to aschedule specified by MPC server 250 from the currently loaded type(e.g., part number) of mother lot tape media reel. As described furtherherein, horizontal tester cell master 264 may control custom part testand program components 390 by retrieving the lot number of each givensublot 220 of custom IC device parts from BKO 202 as well as thespecified test program, and monitoring the custom IC device part testresults. In this manner horizontal tester cell master 264 may controlcustom part test and program components 390 to test, custom program,custom mark, and scan each custom IC device part sublot 220corresponding to a given one of the aggregated custom IC device partorders 211 ₁ to 211 _(N), and to output each of sublots 220 ₁ to 220_(N) together in the same reel of tape and reel media 225. In oneembodiment, the sublots 220 ₁ to 220 _(N) may be output together withempty pockets in between different sublots 220 of custom IC device partsthat are labeled with a tape and reel media cover tape label (or othertype of suitable marking) that indicate each sublot 220 and itscorresponding custom IC device part type. In this regard, multiplesublots 220 ₁ to 220 _(N) corresponding to an aggregated group of customIC device part orders 211 ₁ to 211 _(N) may be all output on a singleoutput reel, and with horizontal tester cell master 264 and custom parttest and program components 390 running unattended or substantiallyunattended by any human operator. After horizontal tester cell master264 and custom part test and program components 390 have completedmanufacture of multiple sublots 220 ₁ to 220 _(N) corresponding to agiven aggregated group of custom IC device part orders 211 ₁ to 211_(N), the single output reel containing these multiple sublots 220 ₁ to220 _(N) may be transferred to FGI 206 for separation and shipping.

In any case, when incoming uncustomized base IC device parts 203 arereceived by components of test system 259 of custom part test andprogram components 390, they first may be programmed by tester logic 261(e.g., firmware and/or software) via part customization insertion newprogramming may be flashed in one or more test sockets 263. Thereafterfirmware programming may be verified and any other needed or desiredtesting (e.g., using high voltage circuitry), if any, performed bytester logic 261 in test sockets 263. In one embodiment, one or morecomponents of test system 259 may be implemented by a packaged partautomatic test equipment (ATE) system that includes test socket/s withInterface Test Adapter (ITA) configured to receive and electronicallycouple to pins and circuits of the incoming uncustomized base devicepart under test (DUT), although any other device testing equipment ormethodology may be employed that is suitable for testing and customprogramming uncustomized base IC parts 203 in a manner as describedelsewhere herein. For example, in one embodiment, testing andprogramming may occur in different sockets, and in another embodimentonly custom programming may be performed without testing.

In a further embodiment, handler 364 may be controlled by horizontaltester cell master 264 to place each of the incoming uncustomized baseIC device parts 203 into the test socket/s of the ATE for testing andcustom programming, and then to remove and transfer each produced customprogrammed IC device part to other components of custom part test andprogram components 390. Handler 364 may be controlled by horizontaltester cell master 264 to place the thus-produced multiple individualcustom programmed IC device parts into respective individual partcompartments of an outgoing tape reel 225 that is then covered with acover tape. Examples of such other components of custom part test andprogram components 390 include, but are not limited to, optional lasermarker 366 that may be configured to mark custom part type identifierinformation indicia on the individual custom programmed parts, optionalscanner 350 (e.g., one or more cameras) that may be configured to 2D or3D image each IC device part from one or more sides to verify no damageto package or leads, to verify package assembler markings, and tape andreel tape labeler 362 that is configured to apply custom part identifierinformation (e.g., such as bar code) to the tape and reel cover tapethat is adjacent a group of tape part compartments of the tape reel 225that contain parts of the same corresponding part type. It will beunderstood that custom part identifier information may be so applied totape media of an outgoing tape reel 225 using any suitable type ofmarking and/or labeling technology, e.g., such as using adhesivelabeling or ink jet printing the custom part identifier information onthe cover tape and/or labeling or printing the custom part identifierinformation on other portion's of the tape media (other than the covertape) and that is adjacent a group of tape part compartments of theoutgoing tape reel 225 that contain a lot 220 of custom IC device partsof the same type (that are programmed from a single incoming mother lotof the same type of uncustomized base IC parts 203 or that areprogrammed from multiple different incoming mother lots of differentrespective types of uncustomized base IC parts 203).

As illustrated in FIG. 3, multiple different sublots 220 of differenttypes of respective custom IC device parts contained in partcompartments of a single outgoing tape reel 225 may be provided (e.g.,manually by human operator 210 or by automated transport device such asconveyor belt, industrial robot, etc.) to finished good inventory (FGI)processing 206. As previously described, human operators and/orautomatic processing equipment of FGI processing 206 may operate toidentify and differentiate between the groups or lots of different typesof custom IC device parts contained in the part compartments of singlereel of tape media 225 by reading the bar code label or other type ofidentifier information displayed on a section of the tape media cover oftape reel 225 that is located adjacent or on the part compartments thatcontain each respective different given type of custom IC device part.As different respective lots of custom IC device parts resulting fromdifferent custom IC device part orders 211 are identified in FGI 206,they may be segregated or singulated from other lots of custom IC deviceparts taken from the same tape media reel 225 and shipped to anappropriate end destination 230 (e.g., destination name and address)that has been specified (e.g., in BKO/MES 202) for each given lot ofcustom IC device parts as illustrated and described in relation to FIG.2. As shown, in one embodiment FGI 206 may read the identifier (e.g.,bar code) information from the labeled tape media cover of tape reel 225and use this information to query BKO/MES 202 and obtain destinationinformation (e.g., destination name and address) for shipping each lotof corresponding custom IC device parts.

It will be understood that in one alternative embodiment, two or moredifferent custom IC device part orders 211 may be received by BKO/MES202 that specify the same type of custom IC device parts (e.g., havingthe same type of custom programming), but destined for differentcustomers or end destination shipping addresses. In such a case, asingle outgoing tape reel 225 may contain multiple different segregatedlots of the same type of custom IC device parts, in which case thedifferent lots of the same type of custom IC device parts may beidentified and differentiated in FGI 206 from other lots of the sametype of custom IC device parts for singulation and shipping to thecorresponding end destination specified for each given lot by thecorresponding custom IC device part order 211. In this regard, andoutgoing tape reel 225 may be post processed in FGI 206 by readinginformation from each tape and reel cover tape label (or otherindicator) to determine the identity of a corresponding sublot 220 _(X)of custom IC device parts, cutting the tape and reel media to singulatethe custom IC device parts of the given sublot 220 _(X), transactingthis sublot 220 _(X) in BKO/MES 202 by barcode automated processing, andplacing the sublot 220 _(X) in a box or other container for shipping toa given end destination 230 _(X) (e.g., customer) that is specified by acorresponding order 211 _(X). This process may be repeated in FGI 206for all sublots 220 ₁ to 220 _(N) contained in the same reel 225 tosatisfy all completed aggregated custom IC device part orders 211 ₁ to211 _(N). Following fulfillment of a first group of aggregated IC devicepart orders 211 ₁ to 211 _(N), a second group of multiple aggregated ICdevice part orders 211 may be similarly processed (e.g., from anotherand different mother lot of IC uncustomized base IC parts 203) foroutput as corresponding multiple separate sublots 220 of custom ICdevice parts in another and different outgoing tape reel 225.

As further illustrated in FIG. 3, horizontal tester cell master 264 maybe configured and coupled to provide test data generated by the testsystem 259 (e.g., yield, part lots on hold, date/time, test equipmentused, parametric data, functional test results etc.) to manufacturingoperations system (MFG1) 380 that may be executing as logic (e.g.,software, firmware, etc.) as a system of servers, file systems, anddatabases. MFG1 380 may also be configured to handle reported test dataand quality checks, e.g., tracking part yield, bin good, bin bad, putlots on hold, provide engineering analysis tools to aid with dispositionof poor yield lots, etc.

FIG. 4 illustrates one exemplary embodiment of components of test system259 as they may be integrated into a single horizontal testing machineand communicatively coupled to tester 261 and horizontal testing logic254, it being understood that any one or more of test system 259components may alternatively implemented as discrete components. Aspreviously described, custom IC device part test and program components390 (that include test system 259) may include one or more processingdevices 293 and associated memory and/or storage that are configured tocontrol operations of the various components. For example, in theillustrated embodiment of FIG. 4, the integrated components of testsystem 259 may include at least one integrated computer workstation,desktop computer, or other operatively coupled arrangement of computercomponents 495 (e.g., CPU, non-volatile random access memory “NVRAM”,non-volatile storage such as hard drive, DRAM, graphics processing unit,network interface controller, etc.) that is configured to communicatewith logic of horizontal tester cell master 264 to control operation ofthe various components of test system 259 and to interface with a humanoperator 210 in a manner as previously described, e.g., via UI 262 ofcoupled horizontal testing logic 254 which in this embodiment may beexecuting on a separate computer server, workstation, etc. that is wiredand/or wirelessly coupled to computer components 495. Computercomponents 495 may also interface via one or more networks or othercommunication paths with other processing devices 293 and networksdescribed in relation to FIG. 2, such as tester 261. Display monitor 404and keyboard or other I/O device 402 may be provided for controlling andmonitoring handler 364.

In the embodiment of FIG. 4, a reel 425 of incoming carrier tape media427 (e.g., 8 mm tape, 12 mm tape, etc.) that contains a single motherlot of identical uncustomized base IC device parts 203. Each of incominguncustomized base IC device parts 203 is detaped by handler 364 and thenmoved (e.g., by a pick and place robot 460) between individual teststations (e.g., sockets 263, etc.) for testing and programming toproduce a custom IC device part 403 as previously described. Programmingof custom IC device parts 403 may be scheduled such that customprogramming of all custom IC device parts 403 corresponding to a givencustom part order 211 _(X) are performed back to back or sequentially asa group, e.g., as a single outgoing lot 220 _(X) of custom IC deviceparts 403. Each of custom IC device parts 403 of each outgoing lot 220is then transferred (e.g., by a pick and place robot 460) to tape andreel tape labeler 362 which is configured to place each custom IC devicepart 403 into a separate part compartment of outgoing carrier tape media429, which may be a single continuous length of carrier tape that may bewound on a single take-up reel.

As previously described, the custom IC device parts 403 of a givenoutgoing lot 220 may be placed in adjacent part compartments (orotherwise grouped together) in the outgoing carrier tape media 429(e.g., 8 mm tape, 12 mm tape, etc.). Tape and reel tape labeler 362 maythen apply a cover tape 502 (shown in FIG. 5) over the outgoing carriertape media 429 and its custom IC device parts 403, and apply custom partidentifier information (e.g., such as bar code printed or sticky label)on the tape media cover tape that is positioned adjacent a group ofcarrier tape part compartments of the tape reel 225 that contain partsof the same corresponding part type, before being wound onto a take-upreel of outgoing tape reel 225 as shown. It will be understood that itis possible to include two or more different tape and reel cover tapelabelers 362 (e.g., that produce different size tape media such as 8 mmand 12 mm respectively) as part of a single integrated machine of testsystem components 259 of custom IC device part test and programcomponents 390, e.g., to allow handler 364 to selectively provide customIC device parts 403 to one of the multiple tape and reel cover tapelabelers 362 that produces the desired size of outgoing tape media(e.g., 8 mm or 12 mm). Any suitable combination of carrier tape media,cover tape, and take-up reel may be utilized in the practice of thedisclosed systems and methods. One example is carrier tape, cover tapeand take-up reel components available from Advantek of Laguna City,Philippines. Such example components include, but not limited to,tri-laminate, polycarbonate, and polystyrene carrier tapes; heatactivated and pressure sensitive cover tapes; and plastic take up reels(e.g., high-impact injection-molded polystyrene in 7″, 13″, 15″, and 22″diameters).

FIG. 5 illustrates a reel 225 of outgoing continuous carrier tape media429 that includes individual part compartments sized to containindividual custom IC device parts 403. In the illustrated embodiment,multiple lots 220 ₁, 220 ₂, 220 ₃, etc. of respective types of outgoingcustom IC device parts 403 ₁, 403 ₂, 403 ₃, etc. have been groupedtogether in adjacent part compartments of a continuous (not-separated)segment or length of carrier tape media 429 prior to covering andsealing the part compartments with cover tape 502 and winding up thecontinuous segment of covered carrier tape on the take-up reel as shown.As further shown, respective custom part identifier information 590 ₀,590 ₁, 590 ₂, 590 ₃, etc. has been applied (e.g., as printed 2D or datamatrix bar code, physical adhesive label with 2D or data matrix barcode, etc.) on the cover tape adjacent (and in this example on each sideof) each lot of custom IC device parts 403 to identify the particularcustom IC device parts 403 (e.g., by particular part order 211, by parttype, etc.) in a manner as previously described. Individual custom ICdevice parts 403 that are covered by cover tape 502 are illustrated withdashed hidden lines in FIGS. 5 and 6, i.e., in FIG. 5 individual customIC device parts 403 ₁ of lot 220 ₁ are illustrated in dashed hiddenoutline between bookended custom part identifier information segments590 ₁ that uniquely identify custom IC device parts 403 ₁, andindividual custom IC device parts 403 ₂ of lot 220 ₂ are illustrated indashed hidden outline between bookended custom part identifierinformation segments 590 ₂ that uniquely identify custom IC device parts403 ₁. Individual custom IC device parts 403 ₃ of lot 220 ₃ are visibleand not yet covered by cover tape 502 which is being applied to tape 429as shown by the arrow in FIG. 5. Individual custom IC device parts 403 ₀of a preceding adjacent lot 220 ₀ are not shown as they are alreadywound on reel 225.

After the continuous segment of covered carrier tape 429 has been woundon the take up reel to form a first outgoing tape media reel 225, thecarrier tape 429 and its cover may be severed or cut and the outgoingreel of media 225 removed from test system 259 for further handing. Anew take-up reel may then be installed on test system 259 and a newcontinuous segment of covered carrier tape 429 (containing one or moredifferent lots of corresponding custom IC device parts 403) may be woundon the new take-up reel to form a second and different outgoing tapemedia reel 225. It will be understood that FIG. 5 is illustrative onlyand that more than three lots 220 of outgoing custom IC device parts 403may be grouped together in adjacent part compartments of a single common(i.e., continuous and non-severed) segment of carrier tape 429, witheach lot 220 of custom IC device parts 403 being labeled with respectivecustom part identifier information 590 as described above.

In the illustrated embodiment, the part identifier information 590(e.g., including lot number, custom ordered part number “OPN”, quantityof parts in the lot, etc.) has been applied over empty part compartments570 to each side of the individual custom IC device parts 403 of eachrespective lot 220 to provide a labeling bookend. In this regard, one ormore empty part compartments 570 may be left between different adjacentlots 220 to assist in easy identification of the custom IC device parts403 of different respective lots 220 ₁, 220 ₂, 220 ₃, etc. when they arelater singulated and separated as a lot in a singulated tape segment(such as singulated tape segment 531 of FIG. 5 that contains custom ICdevice parts 403 ₃ of lot 220 ₃ between custom part identifierinformation 590 ₃ that uniquely identify custom IC device parts 403 ₃)from the rest of carrier tape media 429 of reel 225 for shipment as anindividual lot within the singulated and separated carrier tape mediasegment 531 (and with attached bookended identifiers 590 on either endof each segment) to different respective end destinations 230 as shownin FIG. 6, e.g., at an end destination 230 cover tape 502 may then beremoved from singulated tape segment 531 to expose and access and removethe underlying individual custom IC device parts 403. When so provided,empty part compartments 570 also provide a convenient area where carriertape media may be cut or otherwise separated between different lots 220for boxing and shipping. It will be understood that part identifierinformation 590 may be placed and/or attached relative to acorresponding given lot 220 of custom IC device parts 403 in anylocation suitable for allowing identification of the particular customIC device parts 403 that correspond to the given lot 220, i.e., ateither one or both ends (uptape end and/or downtape end) of the givenlot 220 of custom IC device parts 430 with the latter bookendedembodiment being illustrated in FIGS. 5 and 6.

In one exemplary embodiment, operator 212 of FIG. 2 may read the custompart identifier information 590 (e.g., scan the barcode of the tape andreel label/s 590) for each given detaped lot 220 of devices 403,transact the shipment of the given lot 220 in BKO/MES 202 to determinethe shipment details of the original custom part order 211 correspondingto the current given lot 220, and box and ship or otherwise transportthe custom IC device parts 403 of the given lot 220 to the enddestination 230 specified by the original corresponding custom partorder 211, e.g., within a singulated segment 531 of tape media. It willbe understood that one or more of the preceding steps may bealternatively implemented in automated fashion without human operator212, e.g., such as using automated robot, scanning, labeling, packagingand/or shipping equipment that operate under the control of one or moreprocessing devices 293 that are communicatively coupled to BKO/MES 202.

It will be understood that FIGS. 5 and 6 are exemplary only, and thatpart identifier information 590 may be applied or printed in any othermanner that is suitable for allowing individual custom IC device parts403 of different outgoing multiple lots 220 contained in the carriertape media 429 in the same reel 225 to be later identified and separatedor otherwise distinguished from custom IC device parts 403 of the othermultiple lots 220 on the same reel 225. For example, it is not necessarythat any empty part compartments be left between the parts 403 ofdifferent lots (e.g., custom part identifier information 590 for eachlot 220 may be positioned to be coextensive with the IC device parts 403of the given lot 220 by extending from the first to last IC device parts403 of the given lot 220 without extending to cover IC device parts 403of any other adjacent lot 220). As another possible alternative, custompart identifier information 590 may be printed or applied between partcompartments of carrier tape media 429 that contain different lots 220of custom IC device parts 403 so that parts 403 of adjacent lots 220 maybe distinguished from each other based on the presence of theintervening custom part identifier information 590 between the differentlots 220.

FIG. 7 illustrates an exemplary embodiment of custom part identifierinformation 590 as it may be printed or otherwise applied as describedherein. In this exemplary embodiment, custom part identifier information590 includes the following information for a particular lot 220 ofcustom IC device parts 403: custom ordered part number (OPN), internalpart number (IPN), lot number (LOT), date code (D/C) and quantity (QTY).It will be understood that FIG. 7 is exemplary only and that additional,fewer or alternative types of information may alternatively be includedin custom part identifier information 590, and that custom partidentifier information 590 may be provided in any other suitable format,e.g., all human readable text or other human readable format, allbarcode format of any suitable type (1D, 2D, etc.), any combination ofhuman readable format and barcode (including duplicating some or all ofthe identifier information in both human readable format and barcode),etc.

It will be understood that one or more of the tasks, functions, ormethodologies described herein (e.g., including those described hereinfor components 202, 250, 252, 254, 259, 261, 263, 264, 362, 364, 366,368, 390, 495 etc.) may be implemented by circuitry and/or by a computerprogram of instructions (e.g., computer readable code such as firmwarecode or software code) embodied in a non-transitory tangible computerreadable medium (e.g., optical disk, magnetic disk, non-volatile memorydevice, etc.), in which the computer program comprising instructions areconfigured when executed (e.g., executed on a processing device of aninformation handling system such as CPU, controller, microcontroller,processor, microprocessor, FPGA, ASIC, or other suitable processingdevice) to perform one or more steps of the methodologies disclosedherein. In one embodiment, such processing devices may be selected fromthe group consisting of CPU, controller, microcontroller, processor,microprocessor, FPGA, and ASIC. A computer program of instructions maybe stored in or on the non-transitory computer-readable mediumaccessible by an information handling system for instructing theinformation handling system to execute the computer program ofinstructions. The computer program of instructions may include anordered listing of executable instructions for implementing logicalfunctions in the information handling system. The executableinstructions may comprise a plurality of code segments operable toinstruct the information handling system to perform the methodologydisclosed herein. It will also be understood that one or more steps ofthe present methodologies may be employed in one or more code segmentsof the computer program. For example, a code segment executed by theinformation handling system may include one or more steps of thedisclosed methodologies.

While the invention may be adaptable to various modifications andalternative forms, specific embodiments have been shown by way ofexample and described herein. However, it should be understood that theinvention is not intended to be limited to the particular formsdisclosed. Rather, the invention is to cover all modifications,equivalents, and alternatives falling within the spirit and scope of theinvention as defined by the appended claims. Moreover, the differentaspects of the disclosed systems and methods may be utilized in variouscombinations and/or independently. Thus the invention is not limited toonly those combinations shown herein, but rather may include othercombinations.

What is claimed is:
 1. A system configured to produce customizedintegrated circuit (IC) device parts from multiple incoming uncustomizedbase IC parts, comprising: a test system comprising one or more testsockets, a handler, and an outgoing tape reel; and at least oneprocessing device configured to communicate with the test system andprogrammed to control the handler to place each of multiple incominguncustomized base IC device parts into the test sockets for customprogramming to produce multiple custom programmed IC device parts, andthen to remove and transfer the multiple custom programmed IC deviceparts into individual part compartments of a common carrier tape of theoutgoing tape reel and cover the custom programmed IC device partswithin the individual part compartments with a cover tape over theindividual part compartments; where the at least one processing deviceis further configured to communicate with the test system and programmedto: control test socket custom programming of a common type ofuncustomized base IC parts in different ways so as to produce respectivedifferent types of custom IC device parts specified by different customIC part orders, and then control positioning the different types ofcustom IC device parts specified by the different custom IC part ordersinto separate part compartments defined in the common carrier tape of asingle outgoing reel of tape media.
 2. The system of claim 1, where thehander is configured to receive an incoming reel of tape media thatcontains a single mother lot of a selected common type of identicalincoming uncustomized base IC device parts; and at least one processingdevice configured to communicate with the test system and programmed to:analyze part customization information corresponding to multiple customIC device part orders, each of the multiple custom IC device part ordersspecifying a type of custom IC device part that is different from thetype of custom IC device parts specified by the other multiple custom ICdevice part orders; aggregate the multiple custom IC device part ordersinto at least one group of aggregated custom IC part orders specifyingrespective different types of custom IC device parts to be produced fromthe selected common type of compatible uncustomized base IC parts;control the handler to transfer each of multiple incoming uncustomizedbase IC device parts from an incoming reel of tape media to the testsockets for custom programming; control test socket custom programmingof individual uncustomized base IC parts of the selected common type ofcompatible uncustomized base IC parts in different ways so as to producethe respective different types of custom IC device parts specified bythe group of aggregated custom IC part orders; and then control thehandler to position the different types of custom IC device partsspecified by the group of aggregated custom IC part orders into separatepart compartments defined in the common carrier tape of the singleoutgoing reel of tape media.
 3. The system of claim 1, where the handleris configured to receive an incoming reel of tape media that contains asingle mother lot of a selected common type of identical incominguncustomized base IC device parts; and at least one processing deviceconfigured to communicate with the test system and programmed to:analyze part customization information corresponding to multiple customIC device part orders, each of the multiple custom IC device part ordersspecifying a type of custom IC device part that is different from thetype of custom IC device parts specified by the other multiple custom ICdevice part orders; aggregate the multiple custom IC device part ordersinto at least a first and a second group of aggregated custom IC partorders, the first group of aggregated custom IC part orders specifyingrespective different types of custom IC device parts to be produced froma first selected common type of compatible uncustomized base IC partsand the second group of aggregated custom IC part orders specifyingrespective different types of custom IC device parts to be produced froma second selected common type of compatible uncustomized base IC partsthat is different from the first selected common type of compatibleuncustomized base IC parts; control the handler to transfer each of thefirst selected common type of compatible uncustomized base IC parts froma first incoming reel of tape media to the test sockets for customprogramming; control test socket programming of individual uncustomizedbase IC parts of the first selected common type of compatibleuncustomized base IC parts in different ways so as to produce therespective different types of custom IC device parts specified by thefirst group of aggregated custom IC part orders, and then control thehandler to position the different types of custom IC device partsspecified by the first group of aggregated custom IC part orders intopart compartments defined in the tape of a first single outgoing reel oftape media; control the handler to transfer each of the second selectedcommon type of compatible uncustomized base IC parts from a secondincoming reel of tape media to the test sockets for custom programming;control test socket programming of individual uncustomized base IC partsof the second selected common type of compatible uncustomized base ICparts in different ways so as to produce the respective different typesof custom IC device parts specified by the second group of aggregatedcustom IC part orders, and control the handler to position the differenttypes of custom IC device parts specified by the second group ofaggregated custom IC part orders into part compartments defined in thetape of a second single outgoing reel of tape media that is differentfrom the first single outgoing reel of tape media.
 4. The system ofclaim 1, further comprising at least one processing device configured tocommunicate with the test system and programmed to: control test socketprogramming of a common type of uncustomized base IC parts in differentways so as to produce a first type of custom IC device parts specifiedby a first custom IC part order and to produce a second type of customIC device parts specified by a second custom IC part order; and controlthe handler to position the first type of custom IC device partsspecified by the first custom IC part order as a first lot of multiplecustom IC part devices inserted into adjacent separate part compartmentsdefined in the common carrier tape of a single outgoing reel of tapemedia, and control the handler to position the second type of custom ICdevice parts specified by the second custom IC part order as a secondlot of multiple custom IC part devices inserted into adjacent separatepart compartments defined in the common carrier tape of the singleoutgoing reel of tape media.
 5. The system of claim 4, where the testsystem further comprises a tape reel tape labeler; and where the systemfurther comprises at least one processing device configured tocommunicate with the test system and programmed to: control the tapereel tape labeler to place first unique custom part identifierinformation on the common carrier tape or tape cover adjacent theseparate part compartments containing the first lot of multiple customIC part devices specified by the first custom IC part order; control thetape reel tape labeler to place second unique custom part identifierinformation on the common carrier tape or tape cover adjacent theseparate part compartments containing the second lot of multiple customIC part devices specified by the second custom IC part order; where thefirst unique custom part identifier information identifies the firstcustom IC part order and where the second unique custom part identifierinformation identifies the second custom IC part order.
 6. The system ofclaim 4, further comprising at least one processing device coupled tothe test system to: control the handler to position the first type ofcustom IC device parts specified by the first custom IC part order as afirst lot of multiple custom IC part devices inserted into a first groupof adjacent separate part compartments defined in the common carriertape of the single outgoing reel of tape media; and control the handlerto position the second type of custom IC device parts specified by thesecond custom IC part order as a second lot of multiple custom IC partdevices inserted into a second group of adjacent separate partcompartments defined in the common carrier tape of the single outgoingreel of tape media such that one or more empty part compartments areleft between the first lot of multiple custom IC part devices insertedinto a first group of adjacent separate part compartments and the secondlot of multiple custom IC part devices inserted into a second group ofadjacent separate part compartments.
 7. The system of claim 6, furthercomprising at least one processing device coupled to the test system to:control the handler to place a cover tape over the first and second lotsof multiple custom IC part devices inserted into separate partcompartments defined in the common carrier tape of the single outgoingreel of tape media; and control the tape reel tape labeler to placefirst unique custom part identifier information on the cover tape overthe one or more empty part compartments left between the first lot ofmultiple custom IC part devices and the second lot of multiple custom ICpart devices, the first unique custom part identifier informationidentifying the first custom IC part order.
 8. A method of producingcustomized integrated circuit (IC) device parts from uncustomized baseIC parts, comprising: using at least one processing device to customprogram a common type of uncustomized base IC parts in different ways soas to produce respective different types of custom IC device partsspecified by different custom IC part orders; and then positioning thedifferent types of custom IC device parts specified by the differentcustom IC part orders into separate part compartments defined in acommon carrier tape of a single reel of tape media.
 9. The method ofclaim 8, further comprising: using at least one processing device toanalyze part customization information corresponding to multiple customIC device part orders, each of the multiple custom IC device part ordersspecifying a type of custom IC device part that is different from thetype of custom IC device parts specified by the other multiple custom ICdevice part orders; using at least one processing device to aggregatethe multiple custom IC device part orders into at least one group ofaggregated custom IC part orders specifying respective different typesof custom IC device parts to be produced from a selected common type ofcompatible uncustomized base IC parts; producing the different types ofcustom IC device parts of the group of aggregated custom IC part ordersby custom programming individual uncustomized base IC parts of theselected common type of compatible uncustomized base IC parts indifferent ways so as to produce the respective different types of customIC device parts specified by the group of aggregated custom IC partorders; and positioning the different types of custom IC device partsspecified by the group of aggregated custom IC part orders into partcompartments defined in the tape of a single reel of tape media.
 10. Themethod of claim 8, further comprising: using at least one processingdevice to analyze part customization information corresponding tomultiple custom IC device part orders, each of the multiple custom ICdevice part orders specifying a type of custom IC device part that isdifferent from the type of custom IC device parts specified by the othermultiple custom IC device part orders; using at least one processingdevice to aggregate the multiple custom IC device part orders into atleast a first and a second group of aggregated custom IC part orders,the first group of aggregated custom IC part orders specifyingrespective different types of custom IC device parts to be produced froma first selected common type of compatible uncustomized base IC partsand the second group of aggregated custom IC part orders specifyingrespective different types of custom IC device parts to be produced froma second selected common type of compatible uncustomized base IC partsthat is different from the first selected common type of compatibleuncustomized base IC parts; producing the different types of custom ICdevice parts of the first group of aggregated custom IC part orders bycustom programming individual uncustomized base IC parts of the firstselected common type of compatible uncustomized base IC parts indifferent ways so as to produce the respective different types of customIC device parts specified by the first group of aggregated custom ICpart orders; producing the different types of custom IC device parts ofthe second group of aggregated custom IC part orders by customprogramming individual uncustomized base IC parts of the second selectedcommon type of compatible uncustomized base IC parts in different waysso as to produce the respective different types of custom IC deviceparts specified by the second group of aggregated custom IC part orders;positioning the different types of custom IC device parts specified bythe first group of aggregated custom IC part orders into partcompartments defined in the tape of a first single reel of tape media;and positioning the different types of custom IC device parts specifiedby the second group of aggregated custom IC part orders into partcompartments defined in the tape of a second single reel of tape mediathat is different from the first single reel of tape media.
 11. Themethod of claim 8, further comprising: using at least one processingdevice to custom program a common type of uncustomized base IC parts indifferent ways so as to produce a first type of custom IC device partsspecified by a first custom IC part order and to produce a second typeof custom IC device parts specified by a second custom IC part order;and then using at least one processing device to control positioning ofthe first type of custom IC device parts specified by the first customIC part order as a first lot of multiple custom IC part devices insertedinto adjacent separate part compartments defined in the common carriertape of a first single reel of tape media, and to control positioning ofthe second type of custom IC device parts specified by the second customIC part order as a second lot of multiple custom IC part devicesinserted into adjacent separate part compartments defined in the commoncarrier tape of a second single reel of tape media.
 12. The method ofclaim 11, further comprising using at least one processing device tocontrol placement of first unique custom part identifier information onthe common carrier tape or cover tape adjacent the separate partcompartments containing the first lot of multiple custom IC part devicesspecified by the first custom IC part order; and placing second uniquecustom part identifier information on the common carrier tape or covertape adjacent the separate part compartments containing the second lotof multiple custom IC part devices specified by the second custom ICpart order; where the first unique custom part identifier informationidentifies the first custom IC part order and where the second uniquecustom part identifier information identifies the second custom IC partorder.
 13. The method of claim 12, further comprising: reading the firstunique custom part identifier information on the common carrier tape orcover tape to associate the first lot of multiple custom IC part deviceswith the first custom part IC part order, removing the first lot ofmultiple custom IC part devices from the part compartments defined inthe tape of a single reel of tape media, and transporting the first lotof removed multiple custom IC part devices to a first end destinationspecified by the first custom part IC part order; and reading the secondunique custom part identifier information on the common carrier tape orcover tape to associate the second lot of multiple custom IC partdevices with the second custom part IC part order, removing the secondlot of multiple custom IC part devices from the part compartmentsdefined in the tape of a single reel of tape media, and transporting thesecond lot of removed multiple custom IC part devices to a second enddestination specified by the second custom part IC part order that isdifferent than the first end destination.
 14. The method of claim 11,further comprising using at least one processing device to: controlpositioning of the first type of custom IC device parts specified by thefirst custom IC part order as a first lot of multiple custom IC partdevices inserted into a first group of adjacent separate partcompartments defined in the common carrier tape of a single reel of tapemedia; and control positioning of the second type of custom IC deviceparts specified by the second custom IC part order as a second lot ofmultiple custom IC part devices inserted into a second group of adjacentseparate part compartments defined in the common carrier tape of asingle reel of tape media such that one or more empty part compartmentsare left between the first lot of multiple custom IC part devicesinserted into a first group of adjacent separate part compartments andthe second lot of multiple custom IC part devices inserted into a secondgroup of adjacent separate part compartments.
 15. The method of claim14, further comprising using at least one processing device to: using atleast one processing device to control placement of a cover tape overthe first and second lots of multiple custom IC part devices insertedinto separate part compartments defined in the common carrier tape of asingle reel of tape media; using at least one processing device tocontrol placement of first unique custom part identifier information onthe cover tape over the one or more empty part compartments left betweenthe first lot of multiple custom IC part devices and the second lot ofmultiple custom IC part devices, the first unique custom part identifierinformation identifying the first custom IC part order; then severingthe common carrier tape at or adjacent to the one or more empty partcompartments left between the first lot of multiple custom IC partdevices and the second lot of multiple custom IC part devices; readingthe first unique custom part identifier information on the commoncarrier tape or cover tape to associate the first lot of multiple customIC part devices with the first custom part IC part order; and removingthe first lot of multiple custom IC part devices from the partcompartments defined in the tape of a single reel of tape media, andtransporting the first lot of removed multiple custom IC part devices toa first end destination specified by the first custom part IC partorder.
 16. A reel of tape media comprising: an elongated tape wound on atape reel, the elongated tape comprising multiple separate partcompartments defined therein that are configured to contain integratedcircuit (IC) device parts; and different types of custom IC device partspositioned in the separate part compartments defined in the sameelongated tape wound on the tape reel, the different types of custom ICdevice parts being differently programmed from a common type ofuncustomized base IC part according to the specifications of respectivedifferent custom IC part orders.
 17. The reel of claim 16, where themultiple custom IC device parts include a first type of custom IC deviceparts programmed from a common type of uncustomized base IC partaccording to the specifications of a first custom IC part order, and asecond type of custom IC device parts differently programmed than thefirst type of custom IC device parts from the same common type ofuncustomized base IC part according to the different specifications of asecond custom IC part order.
 18. The reel of claim 17, where the firsttype of custom IC device parts comprise a first lot of multiple customIC part devices inserted into adjacent separate part compartmentsdefined in the elongated tape wound on the tape reel; and where thesecond type of custom IC device parts comprise a second lot of multiplecustom IC part devices inserted into adjacent separate part compartmentsdefined in the elongated tape wound on the tape reel.
 19. The reel ofclaim 18, further comprising first unique custom part identifierinformation placed on the elongated tape adjacent the separate partcompartments containing the first lot of multiple custom IC part devicesspecified by the first custom IC part order; and second unique custompart identifier information placed on the elongated tape adjacent theseparate part compartments containing the second lot of multiple customIC part devices specified by the second custom IC part order; where thefirst unique custom part identifier information identifies the firstcustom IC part order and where the second unique custom part identifierinformation identifies the second custom IC part order.
 20. The reel ofclaim 19, where the first type of custom IC device parts specified bythe first custom IC part order are positioned as a first lot of multiplecustom IC part devices within a first group of adjacent separate partcompartments defined in the common carrier tape of a single reel of tapemedia; and where the second type of custom IC device parts specified bythe second custom IC part order are positioned as a second lot ofmultiple custom IC part devices within a second group of adjacentseparate part compartments defined in the common carrier tape of thesingle reel of tape media such that one or more empty part compartmentsare left between the first lot of multiple custom IC part devicesinserted into the first group of adjacent separate part compartments andthe second lot of multiple custom IC part devices inserted into thesecond group of adjacent separate part compartments.
 21. The method ofclaim 20 further comprising a cover tape placed over the first andsecond lots of multiple custom IC part devices inserted into separatepart compartments defined in the common carrier tape of a single reel oftape media; and where the first unique custom part identifierinformation is present on the cover tape over the one or more empty partcompartments left between the first lot of multiple custom IC partdevices and the second lot of multiple custom IC part devices, the firstunique custom part identifier information identifying the first customIC part order.